Shows / Events
SMT Hybrid Packaging 2017
- System Integration in Micro Electronics -
Date: May, 16-18, 2017 Location: Munich - GERMANY Sectors:Technologies and Processes, Materials and Components, Manufacturing, Manufacturing equipment, Reliability and Test, Software and Systems, Service and Consulting
Here you can see innovative products, future trends and a wide range of service offers. Moreover you can discuss solutions regarding the challenges you are faced to.
- The only trade fair that depicts the entire value chain in electronics manufacturing -
Date: 14. - 17. November 2017 Location: Munich - GERMANY Sectors: PCB and circuit-board manufacturing, electronic manufacturing services (EMS); Component mount tech., soldering tech., test & measurement, quality assurance, product finish., prod. subsystems, prod. logistics and material flow tech.; Manufacturing technologies for cables and connectors, coilware production and hybrid-component manufacturing; Semiconductor/display manufacturing, LEDs and discrete devices, photovoltaics production, micro-/nano-production, clean-room technology, materials processing; IT to Production, Industry 4.0, prod. technologies for batteries and electrical storage, organic and printed electronics, 3D printing, additive manufacturing; Exhibitors in this cluster present products and services that are extremely relevant to the entire value chain and that make routine tasks easier.