The G-TITAN opens up new possibilities in the field of automating the screen printing process. Sixty percent of all faults in the SMT manufacturing process already occur during paste printing. Despite all the improvements of the past years, manual interventions are still for example required in the process of paste application, in this case this does not ensure process reliability in the long term. This is where the new G-TITAN steps in. A bunch of innovative measures, summarised under the concepts of OPC (Opti Print Control) and QPC (Quality Paste Control), increase the degree of automation and drastically reduce errors in the printing process.

OPC – Opti Print Control:

Auto Paste Dispensing: The paste is automatically dispensed across the entire squeegee length, maintaining 15mm rolling diameter, adopting the common 500 g solder paste jar. Resolving the issue of solder paste overflowing to the sides of squeegee due to excessive solder paste applied.

Paste Rolling Diameter Monitoring System: Real time monitoring, closed-loop with the Auto Paste Dispensing system. When paste rolling diameter falls below 10 mm, Auto Paste Dispensing will be activated to top it up to 15 mm, keeping the paste rolling speed within the optimum range (10 mm – 15 mm). With zero human intervention, it results in consistency and best printing quality, making it possible for lights-out production.

OPC Squeegee: Retainers at both sides can be adjusted to the exact length of the PCB, granting absolute control over the desired printing area. No stagnant solder paste, no wastage. Designed with 2 different length, 300 mm and 450 mm, it caters to more than 80 % of the markets’ commonly used board sizes.

QPC – Quality Paste Control:

Stencil Aperture Inspection System: Using panel light installer above and CCD Camera below, it inspects the stencil apertures, eliminating defects from the start. It safeguards printing quality for each PCB models. If a stencil fails the inspection, Auto Paste Dispensing will not be able to commence. It saves solder paste and prevents defects from the beginning.

Stencil Flattener: By sucking the stencil firmly on both sides of the conveyor during the printing cycle through the vacuum suction holes, stencil vibration is eliminated by having firm contact with the PCB. With this, all of today’s available and challenging substrates can be securely clamped and print to the highest quality. Better fill, better shape for 03015 and ultra fine pitch. Also, it successfully reconciled the issue of the forward and backward stroke being different.

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