PLACEMENT SOLUTION
JUKI’s PLACEMENT SOLUTION encompasses a large portfolio of placement machines intended for small, mid-sized and large companies who are looking for flexible, reliable and long-term solutions.
KE-3000
Placement Solution
KE-3000
Speed & Flex Mounter
JUKI’s KE-3000 is a high-speed flexible placement supplier meeting various expectations. JUKI’s KE-3010 Speed Mounter takes on the job of placement from ultra-small components while JUKI’s KE-3020 Flex Mounter is called in to action regarding placement with large and odd-shaped components. Both machines operate with a simultaneous, instantaneous centring of components in favour of a high-speed production.
High Productivity
The high-resolution camera enables high-precision inspection of components such as QFPs with 0.2 mm lead pitch.
High Quality
A non-contact laser sensor measures the height of the PCB to prevent exessive force on components and reduce the risk of damage. This height measurement function sensor can also measure the pick height more accurately and faster than other methods.
Board Size
L size:
410 × 360 mm, Application of long PCB*1 800 × 360 mm
L-Wide size:
510 × 360 mm, Application of long PCB*1 1,010 × 360 mm
XL size:
610 × 560 mm, Application of long PCB*1 1,210 × 560 mm
Component Height
6 / 12 mm (KE-3010)
12 / 20 / 25 mm (KE-3020)
Component Size
KE-3010:
0402 (01005) ~ 33.5 mm (Laser recognition)
3 mm*2 ~ 33.5 mm (Vision recognition, Standard camera)
1.0 × 0.5 mm*3 ~ 20 mm (Vision recognition, High-resolution camera)
KE-3020:
0402 (01005) ~ 33.5 mm (Laser recognition)
3 mm ~ 74 mm / 50 × 150 mm (Vision recognition, Standard camera)
1.0 × 0.5 mm*3 ~ 48 mm or 50 x 120 mm (Vision recognition, High-resolution camera)
Placement Rate
Optimum:
23,500 CPH (KE-3010), 20,900 CPH (KE-3020)
IPC9850:
18,500 CPH (KE-3010), 17,100 CPH (KE-3020)
IC*4:
9,000 CPH*5 (KE-3010), 9.470 CPH*5 (KE-3020)
Placement Accuracy
KE-3010:
Laser recognition ± 0.05 mm (± 3 σ), Vision recognition ± 0.04 mm
KE-3020:
Laser recognition ± 0.05 mm (± 3 σ), Vision recognition ± 0.03 mm (MNVC ± 0.04 mm)
Feeder Inputs
max. 160 in case of 8 mm tape (electric double tape feeder)*6
Power Supply
200 – 415 VAC, 3-phase
Apparent Power
2.2 kVA
Operating Air Pressure
0.5 ± 0.05 MPa
Air consumption
50 L / min
Machine Dimensions (W × D × H*7)*8
1,500 × 1,690 × 1,500 mm (L size)
1,800 × 1,690 × 1,500 mm (L-Wide size)
2,131 × 1,890 × 1,500 mm (XL size)
Mass (approximately)
1,900 kg (L size)
2,250 kg (XL size)
*1 The application of long PCBs is optional.
*2 When using MNVC (option).
*3 KE-3010A: when using the high-resolution camera and MNVC (option); KE-3020VA: when using the high-resolution camera (option).
*4 Effective cycle time: the IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on an M size board (CPH = number of components placed in one hour).
*5 Estimated value when using MNVC and picking up components simultaneously with all nozzles. MNVC is optionally available for KE-3010A; MNVC is standard equipment for KE-3020VA & KE-3020VRA.
*6 When using the EF08HD electric double tape feeder.
*7 Display not included in height.
*8 Dimensions of machine described for conveyor height of 900 mm.
Please refer to product specifications for details.
Specifications and design subject to change without notice.